With the explosion of the LED light market in Chengdu , the R&D competition for LED packaging technology is also fierce. At present, GaN-based LED packages mainly include three types: a formal structure, a flip-chip structure, and a vertical structure. At present, the III-type nitride gallium nitride sapphire material is used as a substrate. Due to the insulation of the sapphire substrate, ordinary GaN is used. In order to solve the heat problem, American Lumileds The phone cable is the cable that connects the phone to the computer.USB Cable general data line rarely dedicated, the general phenomenon is that a data line can be used for a variety of mobile phone models,some models of data line is exaggerated,a line can use 30-40 different types of mobile phones.General data lines are rarely dedicated, the general phenomenon is that a data line can be used for a variety of mobile phone models, some models of data lines are exaggerated, a cable can use 30-40 different types of mobile phones.
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The base LED adopts a formal structure. The light emitted by the active area of ​​the formal structure is via P
The GaN region and the transparent electrode are emitted. The structure is simple and the production process is relatively mature. However, the LED of the formal structure has two obvious disadvantages. First, the LEDs of the formal structure are installed. The electrodes of p and n are on the same side of the LED, and the current must flow laterally through the n-GaN.
The layer causes current crowding, high local heat generation, and limits the driving current. Secondly, due to the poor thermal conductivity of the sapphire substrate, the heat dissipation is seriously hindered. 
Lighting invented Flipchip technology. In this method, a large-sized LED chip having a suitable eutectic soldering is first prepared, and a silicon substrate having a corresponding size is prepared, and a gold conductive layer of the eutectic soldering electrode and a conductive layer (ultrasonic gold ball solder joint) are formed thereon. Then, a large-sized LED chip is soldered to the silicon substrate using a eutectic soldering apparatus. The structure of the package has been greatly improved in heat dissipation, but the usual GaN-based structure-mounted LED is still a lateral structure, and current crowding still exists, which still limits the further improvement of the drive current.
Mobile phone data cable and charging speed has a relationship.The cable connects the phone to the charging head and is mainly responsible for current transmission,so inevitably,it will also affect the charging speed.In addition, the length of the data line also has a certain impact on the charging speed.The shorter Usb Cable Type C is,the faster the charging speed will be. Generally, the standard data line of mobile phones is 1 meter, but in the selection of different use scenarios can also match different lengths of data lines.The charging speed and charging head are also affected by the charging head of the mobile phone.When charging a phone, the charging head determines the amount of voltage and current. Regular charging heads are marked with voltage and current output.
Graphical LED package for flip-chip mounting and vertical structure
The picture above shows the traditional LED package structure
The figure above shows the LED flip-chip structure
The vertical structure can effectively solve the two problems of the LED of the formal structure . The vertical structure GaN-based LED replaces the sapphire substrate with a substrate with high thermal conductivity (substrate such as Si, Ge and Cu), which greatly improves the heat dissipation efficiency; The two electrodes of the vertical structure LED chip are respectively on both sides of the epitaxial layer of the LED, and the n-electrode is passed through the LED epitaxial layer, and the current flowing in the lateral direction is extremely small, so that the current crowding problem of the formal structure can be avoided and the current is increased. The luminous efficiency also solves the problem of shading of the P pole and improves the luminous area of ​​the LED. The peeling of the sapphire layer is a difficult process.
The figure above shows the vertical package structure of the LED.
Although there are obvious advantages in flip-chip and vertical package, but the process is not mature, there are only a small number of manufacturers in mass production. I believe that with the advancement of technology, overcoming the difficulties of process and technology, it will become the mainstream LED package production method in the future .